Session: A | Time Domain Measurement |
Chair: | Brett Grossman, Intel Corporation |
Abstract: | This session explores advancements in time domain approaches to measurement of scattering parameters and the application of time domain characterization to transmission lines in coax and on printed circuit boards. |
| | A-1 | Gating Effects in Time Domain Transforms |
8:10 AM-8:40 AM | J. Dunsmore, Agilent Technologies, Inc., Santa Rosa, United States |
(48) | Gating is well known in modern VNAs for improving or isolating responses from multiple reflections in the frequency and time domain. However, the particular details of how positions of selections of the gate start and stop values, as well as gate shapes and aliasing effects is well documented. This paper presents an explanation of gate band-edge effects due to re-normalization effects, and provides recommendations for improving the effectiveness of gating. |
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A-2 | Measurements of Characteristic Impedance of High Frequency Cables with Time Domain Reflectometry (TDR) |
8:40 AM-9:00 AM | L. Navarro, E. Mayevskiy, T. Chairet, Tyco Electronics Corporation, Wilsonville, United States |
(16) | A new methodology for measuring the cable characteristic impedance (Zo) is presented. The approach employs a least square fit to extract accurate and repeatable Zo values from the TDR measurements. The RLGC circuit modeling explores various cable losses and shows that the proposed approach agrees with the transmission line theory. A frequency domain plot of Zo measurements correlates with the new methodology. The proposed methodology equips a test engineer with a quantifiable and efficient way to evaluate the cable performance as a function of environmental and physical changes. |
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A-3 | Comparison Between Root-Impulse-Energy and Vector Network Analyzer Methods for Measuring Loss on Printed Circuit Boards |
9:00 AM-9:20 AM | M. Harper, N. Ridler, M. Salter, National Physical Laboratory, Teddington, United Kingdom |
(12) | This paper presents a comparison of two methods for measuring the dissipative component of electrical loss for transmission lines on printed circuit boards (PCBs) or printed wiring boards (PWBs). The two methods are (i) the root impulse energy (RIE) method which is a TDR based method using a pulse generator and a sampling oscilloscope and (ii) a method based on the use of a vector network analyzer (VNA) to measure the S-parameters of the line in the frequency domain. Results obtained by the two methods for connectorized microstrip lines on flexible FR4 are presented and compared. |
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