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Session: TU3E1:20 PM Tuesday, June 17, 2008 Room: A402/403 |
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Session: TU3E | Microwave Packaging and Materials |
Chair: | Wolfgang Heinrich, Ferdinand-Braun-Institut (FBH) |
Co-Chair: | Kenichi Maruhashi, NEC |
Abstract: | This session covers various aspects of packaging, interconnects and related material issues |
| | TU3E-01 | A Compact Dual Band 802.11n Front-End Module for MIMO Applications Using Multi-Layer Organic Technology | 1541 | S. Dalmia, L. Carastro, R. Fathima, V. Govind, J. Dekosky, S. Lapushin, R. Wu, B. Bayruns, G. White, Jacket Micro Devices, Atlanta, United States |
| This paper presents a novel module technology for 802.11a/b/g/n applications. As an example, the authors demonstrate the first 6.0mm x 5.0mm x 1.2mm module which includes a dual band transmit section with pre and post power-amplifier (PA) filtering, and a dual band receive section with pre and post low-noise amplifier (LNA) filtering. | | |
TU3E-02 | Development of LCP Surface Mount Package with a Bandpass Feedthrough at K-band | 1291 | M. P. McGrath1, K. Aihara1, A. Pham1, S. R. Nelson2, 1Microwave Microsystems Laboratory, University of California at Davis, Davis, United States, 2REMEC Defense and Space, Richardson, United States |
| We present the development of thin-film Liquid Crystal Polymer (LCP) surface mount packages with a novel bandpass feedthrough at K-band (18 -27 GHz). The packages are constructed using multi-layer LCP films and can be surface mounted on a printed circuit board. Our experimental results demonstrate that the bandpass package feedthrough transition including bond wires achieve a return loss of 13 dB or higher and an insertion loss of less than 0.5 dB across K-band. The package transition offers 0.2 dB insertion loss and 15 dB return loss across X-band, and operates well across 8 – 27 GHz. | | |
TU3E-03 | Novel Enhanced-Thickness Magnetic Nanoparticle Thin-Films for System-On-Chip (SOC) Wireless Applications | 1582 | Y. Li1, H. Doo2, B. Pan1, M. M. Tentzeris1, Z. J. Zhang2, J. Papapolymerou1, 1Georgia Institute of Technology, Atlanta, United States, 2Georgia Institute of Technology, Atlanta, United States |
| In this paper, the propagation characteristics of an enhanced-thickness magnetic nanoparticle thin film are investigated on high resistivity silicon substrate for the first time up to 60 GHz. Contrary to other thin films, this nanoparticle thin film can achieve a thickness up to several hundred nanometers, even to micron. The enhanced thickness of this thin film is achieved by repeated coating of CoFe2O4 and poly, thus providing the thin film with the high permeability capable of potential practical wireless applications. FGC waveguides are fabricated and characterized on silicon with the novel thin film. Results show that the FGC waveguides with the thin film feature a lower attenuation compared to those on silicon for frequencies higher than 18 GHz. The extracted relative permeability has a value of 68 by matching of the effective combined dielectric/magnetic constant between simulation and measurement. | | |
TU3E-04 | Carbon Nanotube-based polymer composites for microwave applications | 1431 | S. Pacchini1, T. Idda1, D. Dubuc1, E. Flahaut2, K. Grenier1, 1Laas-Cnrs, Toulouse, France, 2Cnrs-Ups-Inpt, Toulouse, France |
| In this paper, the impact of double-wall carbon nanotubes (DWCNTs) concentration within BenzoCycloButen (BCB) composites on electromagnetic properties is evaluated and modeled with coplanar test structures. It is demonstrated that only 0.37wt. % of DWCNT concentration increases the line losses level by more than a decade over a large frequency range. The resulting engineerable composite brings to RF-designer a novel degree of freedom to design and optimize microwave innovative components. | | |
TU3E-05 | Filtering Land Pattern for Miniature Mechanical Switch Connector | 1518 | D. Lo Hine Tong, P. Minard, J. Le Bras, Thomson, Cesson Sevigne, France |
| This paper reports on a novel design of land pattern for the assembly of miniature mechanical switch connectors (MMSC) onto printed circuit board (PCB). In contrast to conventional MMSC land pattern which features a non-selective response, the novel pattern offers a filtering response that can reject undesired spurious or interfering signals of a wireless system. The design has been developed for IEEE 11a/b/g WLAN applications in the 2.4GHz and 5GHz bands. Prototypes have been fabricated and experimentally verified to show their performance in comparison with the ones simulated electromagnetically in 3D. | | |
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